Tungsten Base Alloys with Low Thermal Expansion Coefficient. (1 st Report)
نویسندگان
چکیده
منابع مشابه
Ultra-High Accuracy Measurement of the Coefficient of Thermal Expansion for Ultra-Low Expansion Materials
Microlithographic systems rely on precision alignment and a high-level of dimensional stability to achieve required performance. In critical applications, immunity to thermally induced dimensional changes is achieved by the use of low coefficient of thermal expansion (CTE) materials such as ULE® in components such as reflective optics and machine structures. ULE® has an expansion coefficient (α...
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The accurate value of thermal expansion coefficient ( ) of thin film is an important thermal property in the design of microelectronic devices and microsystem. This research presents a microbridge buckling deformation caused by the residual stresses to determine the of thermal oxide (SiO2) film. The extraction of is supported through experimental means and finite element analysis (FEM) of the b...
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ژورنال
عنوان ژورنال: Journal of the Japan Society of Powder and Powder Metallurgy
سال: 1962
ISSN: 0532-8799,1880-9014
DOI: 10.2497/jjspm.9.177